separation by implantation of oxygen SOI waferSIMOX

基本解释SOI 晶圆

网络释义

1)separation by implantation of oxygen SOI waferSIMOX,SOI 晶圆2)SOI wafer,SOI晶圆3)bonding silicon on insulator wafer,矽绝缘体(SOI) 接合晶圆4)SOI,SOI5)Silicon on insulator,SOI6)wafer,晶圆7)Wafer bumping,晶圆凸起8)300mm wafer line,300mm晶圆线9)wafer fabrication,晶圆加工10)(111)silicon,(111)硅晶圆

用法和例句

The quality of SOI wafer mainly depends on the structure of Top-Si as well as BOX(Buried Oxide).

SOI晶圆材料正在成为制备IC芯片的主要原材料。

Study of the Single-Event Effect of SOI NMOSFET by 3-D Simulation;

SOI NMOSFET单粒子效应的3-D模拟

The Design of Three-Axis Accelerometer Based on SOI;

基于SOI的三轴压阻微加速度计的设计

Simulation experiment of tolerance of irradiation about domestic SOI 1750A microprocessor;

国产SOI 1750A微处理器抗辐射效应模拟试验

An ultracompact 3 dB coupler is designed and fabricated in silicon on insulator,based on 1×2 line tapered multimode interference (MMI) coupler.

采用线锥形结构 ,在 silicon- on- insulator(SOI)材料上设计并实现了一种新的紧缩型 3- d B多模干涉耦合器(MMI) 。

A 4×4 area modulation silicon on insulator (SOI) multimode interference coupler optical switch, composed of four cascaded 2×2 area modulation optical switches, has been designed.

根据区域调制多模干涉耦合器光开关的工作原理 ,以 2× 2区域调制多模干涉光开关为基础 ,采用级联的方式设计了 4× 4区域调制多模干涉SOI光波导开关。

Silicon on insulator(SOI) structure, as a very large scale integrated circuit(VLSI) wafer, has attractive features such as radiationhardening, no parasitic capacitance and latchup effect.

绝缘体上生长的薄单晶硅膜 (SOI)具有良好的横向绝缘、抗辐照、无锁存效应和无寄生电容 ,并能有效地提高硅集成电路的速度和集成度 ,在深亚微米 VL SI技术中 ,具有很大的优势和潜力。

Evolution of Wafer-Surface Preparation for Semiconductor Industry;

半导体产业中晶圆片表面处理的发展

The structural design of the wafer expansion device was put forward.

该装置可完成片盒、内圈和外圈的输入和取片动作,实现扩晶过程张紧力的调节控制、分离晶圆和衬架、排出空片盒和废弃的衬架等。

We present a FEM method for forecasting the suitable pressure on the retaining ring,which is critical in manufacturing good quality wafers.

随着晶圆直径的增加,在CMP加工过程中,晶圆边缘容易出现"过磨(over-grinding)"现象,降低了平坦度和晶圆利用率。

According to the characteristics,the modeling problem using Petri net for cluster tools in wafer fabrication was studied.

晶圆加工过程中使用的模块化组合设备具有可重构性,设备配置的复杂程度由晶圆加工工艺方案决定,针对这一特点,研究了晶圆加工系统的Petri网建模问题。

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